Nanocyl Carbon Nanotubes compounds are being used today to meet the industry’s growing requirements for electrostatic discharge (ESD) protection and high cleanliness.
With the miniaturization of integrated circuits (IC), the electronic industry is facing new challenges to protect devices from ESD and overheating. During the IC production process, the accumulation of electrons in clean rooms can induce charge-up to several thousand volts. As little as 20 volts is sometimes enough to damage the microchip, leading to erroneous readings and permanent damages.
By imparting electrical conductivity to the plastic parts at a low loading, and by meeting more stringent clean room requirements, Carbon Nanotubes Technology (CNT) is increasingly being qualified by OEMs and microchip manufacturers. Typical applications are IC trays, IC test sockets, and wafer carriers.
- IC - JEDEC Trays
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IC trays or JEDEC trays are used in the handling and shipping of integrated circuits. These trays have to be antistatic to reduce ESD damages. These damages can occur during the IC production, testing and packaging phases, and during shipping too. CNT-based IC trays have homogeneous conductivity on their surfaces which provides ESD protection at a competitive cost. CNT-based IC trays also have higher cleanliness, dimensional stability and recyclability.
Related papers (pdf - 144.94 kB)
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- IC Test and Burn Sockets
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After production and packaging, microchips are tested in IC test burn sockets. These sockets are used for testing the quality of the chips and their signal integrity. To control the specifications of the chips, the sockets are continuously loaded, transported and unloaded during the testing phases. These movements can create an accumulation of electrical charges, eventually leading to ESD problems. CNT-based sockets offer a solution by providing static decay time, homogeneous electrical conductivity on the surface, better mechanical properties and resistance to high temperatures.
Related papers (pdf - 144.94 kB)
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- Wafer Carriers
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Silicon wafer technology has grown by leaps and bounds. Foundries have significantly increased their productivity and global output. Today, besides 150 mm and 250 mm wafers, 300 mm wafers are now available, and are being used in leading-edge circuitry. As with other IC applications, CNT-wafer carriers provide the highest level of ESD protection and cleanliness, combined with improved mechanical properties, at low cost. They offer protection against wafer hazing, ionic outgassing, and meet Class 100 clean room requirements. |
